Qingzhou CuiJan 2, 20205 minPhotosensitive Polyimide/Polybenzoxazole Part 2: Material Properties The reason that photosensitive PI/PBO have become the material of choice for semiconductor advanced process is due to many desired...
Qingzhou CuiDec 2, 20193 minThe Key to Advanced Packaging Technology – Photosensitive Polyimide/Polybenzoxazole Part 1: PrefaceWe are living in an unpreceded time with life style never expected by our ancestors. Especially, the high-speed internet and mobile...
Qingzhou CuiJul 16, 20183 min60 Years of Photoresist Materials Part 7: the End of Optical Photolithography and OutlookAfter delayed many times, EUV (@13nm) photolithography finally arrived and new EUV steppers from ASML are being installed for major chip...
Qingzhou CuiJun 19, 20184 min60 Years of Photoresist Materials Part 6: DUV 193nm immersion Photoresists and beyondFollowing the Moore’s law, 157nm photolithography would be the logic next step after the 193nm dry photolithography. But it turned out...